Topics | PESM 2026 - Grenoble, France

Topics

Topic 1: Plasma etching processes for advanced CMOS, memory & quantum technologies
- FEOL and BEOL patterning for logic devices (Finfet, FDSOI, GAA, CFET, …)
- Memory technologies (OXRAM, PCRAM, FeRAM, MRAM, …)
- Quantum applications (patterning and etching of superconductors, ultralow damage etching of quantum materials …)
Topic 2: Plasma etching processes for more than Moore applications
- MEMS, NEMS
- Imagers
- Photonics
- Power electronics
- LEDs
- Solar cells...
Topic 3: Emerging plasma etching concept and technology
- Plasma-enhanced and thermal ALE (atomic layer etching)
- Isotropic etching (stacked nanosheet fabrication, MEMS/NEMS release, …)
- Alternative patterning (block copolymer, TSD (topographic selective deposition) …)
- Novel etch gas and chemistries
- Cryo-etching
Topic 4: Plasma diagnostic, simulation and machine learning
- New plasma sources
- Plasma /reactor diagnostics
- Process and surface chemistry modeling
- Artificial intelligence/machine learning
Topic 5: Sustainable processes in micro & nanotechnology
- Life cycle analysis of dry and wet etchings
- Evaluation of new and low GWP gases
- Process and chamber cleaning optimization, analysis of abatement step
Topic 6: Dry stripping and cleaning processes
- Surface cleaning and decontamination
- Study of dry-wet interactions
- Charging, corrosion and collapse issues