• INVITED SPEAKERS

  • ► Topic 1: Plasma etching processes for advanced CMOS, memory & quantum technologies
     
    Koichi MOTOYAMA
    IBM, USA
    “Fully subtractive Ru Topvia as a post-Cu alternative metal interconnect for advanced technology nodes”
    Biography:
    Dr. Koichi Motoyama has been a Senior Engineer for advanced interconnect integration at IBM Research in Albany, New York since 2013. Currently, he is a lead integration engineer for developing post-Cu alternative metal interconnects in advanced nodes. Prior to joining IBM, he was employed at Renesas Electronics from 1998 until 2012 as a principal engineer and manager responsible for BEOL metallization development. He has received several high-level IBM technical awards, and three IEEE IITC Michel Lerme Best Paper Awards in 2018, 2020, and 2022. He has given invited talks and short course lectures in multiple conferences. He has reviewed papers for multiple journals and proceedings and has over 100 publications and 100 patents. He received his B.S. and M.S. in Chemistry from Keio University, and his Ph.D. in Materials Science from Tohoku University.
  • ► Topic 2: Plasma etching processes for more than Moore applications
     
    Karim HASSAN
    CEA-Leti, France
    “Advanced photonics platforms based on SOI, SiN, and heterogeneous integration”
    Biography:
    Karim Hassan received the Ph.D. degree in physics from the University of Burgundy, Dijon, France, in 2013 on the development of thermo-optical plasmonic routers for telecom applications, in the framework of the European project FP7-PLATON. Since 2014, he has been with the CEA-Leti (France) as a Research Fellow. He has been involved in both industrial R&D projects and collaborative projects either as a technical contributor (H2020-COSMICC) or as WP Leader and Project Board member (FP7-SEQUOIA, H2020-PICTURE). His research interests include the design, fabrication, and characterization of photonics integrated circuits, hybrid III-V on silicon laser sources, and topological optimization for nanophotonics. He has authored or co-authored more than 100 journal publications, conference papers, and patents. Since 2022, Karim HASSAN is the Head of Silicon Photonics Laboratory under the Optics and Photonics Division at CEA-Leti.
  • ► Topic 3: Emerging plasma etching concept and technology
     
    Julie BANNISTER
    TEL, USA
    “Innovating Etch Technology for Emerging Market Applications”
    Biography:
    Julie started her career in the semiconductor industry at Sematech before moving to Tokyo Electron America where she has worked for over 20 years. Her roles at TEL have included plasma etch process engineering and management for memory and logic customer development support before transitioning to marketing. In her current position she drives strategic marketing for emerging semiconductor markets. Julie has been an active member of the semiconductor community through her committee leadership of the Advanced Etch and Integration Conference at SPIE Advanced Patterning and more recently joining SEMI’s GAAC Americas. She received her BS in Chemical Engineering from the University of Texas at Austin.
  • ► Topic 4: Plasma diagnostic, simulation and machine learning
     
    Mark J. KUSHNER
    University of Michigan, USA
    Biography:
    Mark J. Kushner is the William P. Allis Distinguished University Professor in the Electrical and Computer Engineering Department at the University of Michigan, USA.  He received his Ph.D. from the California Institute of Technology, and was Sandia National Laboratory, Lawrence Livermore National Laboratory and Spectra Technology before joining the University of Illinois at Urbana-Champaign where he was the Founder Professor.  Prof. Kushner was Dean of Engineering at Iowa State University before joining UM in 2008 as founding director of the Michigan Institute for Plasma Science and Engineering.  He co-chaired the National Academies 2020 Decadal Report on Plasma Science and is a member of the US National Academy of Engineering. Prof. Kushner's research areas are low temperature plasmas, plasma-surface interactions and their applications.
  • ► Topic 5: Sustainable processes in micro & nanotechnology
     
    Marine CAZES
    Technic France    		 Jérôme DAVIOT
    Technic France
     
  • ► Topic 6: Dry stripping and cleaning processes  
    Philippe GARNIER
    STMicroelectronics, France
    Biography:
    With 25 years of experience in wet process technology for semiconductor manufacturing, Philippe is an R&D senior expert in materials and surface preparation at STMicroelectronics. Starting in 2001 as process engineer for Philips semiconductors, within the Crolles Alliance, he has developed pioneering wet single wafer tools and gate oxide patterning techniques. In 2008, he was developing 32/28nm nodes for ST Microelectronics, within the IBM Alliance, East Fishkill, NY, USA. Along his carreer at STMicroelectronics, he has been deeply involved in the development of many technologies (eDRAM, eNVM, Logic, FDSOI, Photonics, image sensors, BiCMOS and Qubits). His innovations have improved manufacturing efficiency, reduced costs, and enhanced product quality. In addition, Philippe supervises PhD studies on topics such as wetting, acoustics, wet chemistry infiltration, and particle removal. Senior Member of the ST Technical Staff, Philippe has an MS in Chemistry from ENSIACET, Toulouse, France. He has published over 60 papers at international conferences.
  • Event PlanneR
    Registration
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    Organization
    CEA-Leti
    17 avenue des martyrs, 38054 Grenoble Cedex, France
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    pesm2026-organization@inviteo.fr
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